Department of Mechanical Engineering, Tsinghua University, Research fellow, 2013-Present, full time
Department of Precision Instrument, Tsinghua University, Research fellow, 2003.1-2012.12, full time
Department of Precision Instrument, Tsinghua University, Associate research fellow, 1996.4-2002.12, full time
Tsinghua University, Post-doctor, Lecturer, 1994.4-1996.3, full time
Cheung Kong Scholar Chair Professor (2009)
National Science Fund for Distinguished Young Scholars (2008)
1st-Class China University in Natural Sciences (2010)
2nd-Class National Progress Awards (2008)
1st-Class China University in Natural Sciences (2001)
3rd-Class Natural Sciences Award of Chinese Academy of Sciences (1998)
[1] Hegeng Mei, Xinchun Lu, The quantitative description between zeta potential and fluorescent particle adsorption on Cu surface, SURFACE AND INTERFACE ANALYSIS, 46(2014), 56-60
[2] Zhimin Chai, Yuhong Liu, Xinchun Lu, Dannong He, Reducing Adhesion Force by Means of Atomic Layer Deposition of ZnO Films with Nanoscale Surface Roughness, ACS APPLIED MATERIALS & INTERFACES, 6(2014), 3325-3330
[3] Zhimin Chai, Yuhong Liu, Xinchun Lu, Dannong He, Nanotribological Behavior of Ultra-thin Al2O3 Films Prepared by Atomic Layer Deposition, TRIBOLOGY LETTERS, 55(2014), 143-149
[4] Jing Li, Yuhong Liu, Yuanjing Dai, Dachuan Yue, Xinchun Lu, Jianbin Luo, Achievement of a near-perfect smooth silicon surface, SCIENCE CHINA TECHNOLOGICAL SCIENCES, 56(2013),2847-2853
[5] Tongqing Wang, Xinchun Lu, Dewen Zhao, Yongyong He, Jianbin Luo, Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer, MICROELECTRONIC ENGINEERING, 112(2013), 5-9
[6] Jing Li, Yuhong Liu, Xinchun Lu, Jianbin Luo, Yuanjing Dai, Material Removal Mechanism of Copper CMP from a Chemical–Mechanical Synergy Perspective, TRIBOLOGY LETTERS, 49(2013), 11-19
[7] Hongkai Li, Zilian Qu, Qian Zhao, Fangxin Tian, Dewen Zhao, Yonggang Meng, Xinchun Lu, A reliable control system for measurement on film thickness in copper chemical mechanical planarization system, REVIEW OF SCIENTIFIC INSTRUMENTS, 84(2013), 125101
[8] Guiquan Han, Yuhong Liu, Xinchun Lu, Jianbin Luo, A flexible nanobrush pad for the chemical mechanical planarization of Cu/ultra-low-к materials, NANOSCALE RESEARCH LETTERS, 7(2012),1-5
[9] Yan Pan, Yuhong Liu, Xinchun Lu, Guoshun Pan, Jianbin Luo, The Role of Hydroxyethyl Cellulose (HEC) in the Chemical Mechanical Planarization of Copper, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 159(2012), H329-H334
[10] Zhimin Chai, Xinchun Lu, Dannong He, Atomic Layer Deposition of Zinc Oxide Films: Effects of Nanocrystalline Characteristics on Tribological Performance, SURFACE & COATINGS TECHNOLOGY, 207(2012), 361-366
[11] Dewen Zhao, Yongyong He, Xinchun Lu, In situ measurement of fluid pressure at the wafer-pad interface during chemical mechanical polishing of 12-inch wafer, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 159(2011), H22-H28
[12] Yating Huang, Dan Guo, Xinchun Lu, Jianbin Luo, Modeling of particle removal processes in brush scrubber cleaning, WEAR, 273(2011), 105-110
