Ph.D., Mechanical Engineering, Tsinghua University, 2012.1

B.S., Agricultural Mechanization and Automation, Jilin University, 2006.7

2014.1-Present, Dept. of Mechanical Engineering, Tsinghua University, Assistant Research Fellow

2012.1-2013.12, Dept. of Precision Instrument, Tsinghua University, Postdoctoral Research

Nanotribology

Chemical-Mechanical Planarization (CMP)

The 2010 Tsinghua University Doctoral Student Academic Forum Award for the best academic report, 2010.11

[1] Wang T Q, Lu X C, Zhao D W, He Y Y. Contact stress non-uniformity of wafer surface for the multi-zone chemical mechanical polishing process. SCIENCE CHINA Technological Sciences, 2013, 56(8).

[2] Wang T Q, Zhao D W, He Y Y, Lu X C. Effect of slurry injection position on material removal in chemical mechanical planarization. International Journal of Advanced Manufacturing Technology, 2013, 67(9-12).

[3] Wang T Q, Lu X C, Zhao D W, He Y Y, Luo J B. Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer. Microelectronic Engineering, 2013, 112.

[4] Wang T Q, Lu X C. Numerical and experimental investigation on multi-zone chemical mechanical planarization. Microelectronic Engineering, 2011, 88(11).

[5] Wang T Q, Lu X C, Zhao D W, Luo J B. Characterization of pattern dependencies in copper chemical mechanical planarization. Proceedings of the 3rd International Tribology Symposium of IFToMM, Luleå, Sweden, March 19-21, 2013.