The World Semiconductor Conference 2019 took place in Nanjing International Exhibition Center on May 17th.
The “12 inch Chemical Mechanical Polishing Tool（Model: Universal-300 Plus）” developed by CMP team which leaded by Professor Lu Xinchun in department of mechanical engineering achieved “2018 semiconductor innovative product in China”due to its outstanding innovation and excellent performance.
World-known experts in semiconductor field were invited to the conference to discuss forefront trends and development situation of world semiconductor industry. In order to promote domestic semiconductor product and technical innovation achievement as well as speed up innovative achievement industrialization, “The 13thChina Semiconductor Innovative Product and Technology Conference” was jointly held by China Semiconductor Industry Association, China Electronics Materials Industry Association, China Electronic Production Equipment Industry Association and China Electronics News，theselection result of semiconductor innovation product and technology in this conference was officially published in The World Semiconductor Conference.
